• Product 30 of 31
SYSPANA5-XL

19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back, 1 U; depth: 230 mm

  • Product 30 of 31
SYSPANA5-XL

19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back, 1 U; depth: 230 mm

246,00 €*

Advantages:

  • High packing density on 1 RU
  • Great variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)
  • Large installation depth for an easy integration of active electronics
  • Flexible, fast equipping
  • Subsequently alterable and thus future-proof
Article number SYSPANA5-XL
Type 19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back
Back 28 metal reeds, M4-PE-bolts
Depth [mm] 230
Height unit [HE] 1
Modularly equippable 19“ 1 RU panel, made of zinc-plated and powder-coated sheet steel for flush-mount attachment of five CARDINAL DVM-modules, SYFB21 or SYC1 modules. Tray housing, closed on three sides with 228 mm of installation depth.
The large installation depth enables an easy integration of active electronics.
A labeling profile for holding 7 mm paper strips or 6 mm self-adhesive labeling strips can be fixed through pre-punched holes for taking up M2.5 self-tapping screws. Likewise a cover (2 x SYSPAN-C) can be mounted to seal the entire housing top.
The rear side offers 28 metal tongues as strain reliefs via cable ties plus an M4 grounding point.
Front panel thickness 2.5 mm
Dimensions: 483 x 230 x 44 mm
Color: RAL7016 powder labeling with fine-structure surface

Advantages:
- High packing density on 1 RU
- Great variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)
- Large installation depth for an easy integration of active electronics
- Flexible, fast equipping
- Subsequently alterable and thus future-proof

Technical Data:
- Article number: SYSPANA5-XL
- Type: 19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back
- Back: 28 metal reeds, M4-PE-bolts
- Depth: 230 mm
- Height unit: 1 HE

Advantages:

  • High packing density on 1 RU
  • Great variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)
  • Large installation depth for an easy integration of active electronics
  • Flexible, fast equipping
  • Subsequently alterable and thus future-proof
Article number SYSPANA5-XL
Type 19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back
Back 28 metal reeds, M4-PE-bolts
Depth [mm] 230
Height unit [HE] 1
Modularly equippable 19“ 1 RU panel, made of zinc-plated and powder-coated sheet steel for flush-mount attachment of five CARDINAL DVM-modules, SYFB21 or SYC1 modules. Tray housing, closed on three sides with 228 mm of installation depth.
The large installation depth enables an easy integration of active electronics.
A labeling profile for holding 7 mm paper strips or 6 mm self-adhesive labeling strips can be fixed through pre-punched holes for taking up M2.5 self-tapping screws. Likewise a cover (2 x SYSPAN-C) can be mounted to seal the entire housing top.
The rear side offers 28 metal tongues as strain reliefs via cable ties plus an M4 grounding point.
Front panel thickness 2.5 mm
Dimensions: 483 x 230 x 44 mm
Color: RAL7016 powder labeling with fine-structure surface

Advantages:
- High packing density on 1 RU
- Great variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)
- Large installation depth for an easy integration of active electronics
- Flexible, fast equipping
- Subsequently alterable and thus future-proof

Technical Data:
- Article number: SYSPANA5-XL
- Type: 19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back
- Back: 28 metal reeds, M4-PE-bolts
- Depth: 230 mm
- Height unit: 1 HE
* incl. tax, plus shipping, without trade discount.