The SYSPANEL5-XL allows the fast and easy construction of patch panels, device connection panels or transfer points, e.g. in control or equipment rooms. On the front and back side it can be equipped with up to up to 5 CARDINAL DVM 1 WU units (e.g. DVM-SYS-DIS, DVM-SYS-DISH, DVM-HDF4-FIBER-over-HDMI® or also SYSBOXX SYKP cassette profile), 5 SYSBOXX front panels (1 WU, SYFB21-…) or also 5 SYSBOXX connection modules (1B, SYC1-…), thus enabling the realization of modular 1 RU connection panels. The large housing depth also allows an easy integration of extender systems or format changers. The module fronts are integrated flush-mount into the housing front or back. The individual lettering can be done using our SYSBOXX labeling profile. Optionally the SYSPANEL can be closed from above with two covers (SYSPAN-C). The supplied rack brackets can be mounted in any orientation on the front or rear side of the device. The labeling profile as well as the modules are fastened in a time-saving manner with self-tapping M2.5 Torx screws.
Advantages:
High packing density on 1 RU
Great variability due to a wide selection of front panels for front and rear side (e.g. for building a connection panel for media servers)
Large installation depth for an easy integration of active electronics
Flexible, fast equipping
Subsequently alterable and thus future-proof
Article number
SYSPAN55-XL
EAN
4049371402385
Type
SYSPANEL housing 19” for 5 x SYFB21/SYCFB21 panels on front and rear
Back
28 metal reeds, M4-PE-bolts
Depth [mm]
230
Height unit [HE]
1
Modularly equippable 19“ 1 RU panel, made of zinc-plated and powder-coated sheet steel for flush-mount attachment of five CARDINAL DVM-modules, SYFB21 or SYC1 modules. Tray housing, closed on three sides with 228 mm of installation depth.The large installation depth enables an easy integration of active electronics.A labeling profile for holding 7 mm paper strips or 6 mm self-adhesive labeling strips can be fixed through pre-punched holes for taking up M2.5 self-tapping screws. Likewise a cover (2 x SYSPAN-C) can be mounted to seal the entire housing top.The rear side offers 28 metal tongues as strain reliefs via cable ties plus an M4 grounding point.Front panel thickness 2.5 mmDimensions: 483 x 230 x 44 mmColor: RAL7016 powder labeling with fine-structure surfaceAdvantages: - High packing density on 1 RU - Great variability due to a wide selection of front panels for front and rear side (e.g. for building a connection panel for media servers) - Large installation depth for an easy integration of active electronics - Flexible, fast equipping - Subsequently alterable and thus future-proofTechnical Data:- Article number: SYSPAN55-XL - EAN: 4049371402385 - Type: SYSPANEL housing 19” for 5 x SYFB21/SYCFB21 panels on front and rear - Back: 28 metal reeds, M4-PE-bolts - Depth: 230 mm- Height unit: 1 HE
The SYSPANEL5-XL allows the fast and easy construction of patch panels, device connection panels or transfer points, e.g. in control or equipment rooms. On the front and back side it can be equipped with up to up to 5 CARDINAL DVM 1 WU units (e.g. DVM-SYS-DIS, DVM-SYS-DISH, DVM-HDF4-FIBER-over-HDMI® or also SYSBOXX SYKP cassette profile), 5 SYSBOXX front panels (1 WU, SYFB21-…) or also 5 SYSBOXX connection modules (1B, SYC1-…), thus enabling the realization of modular 1 RU connection panels. The large housing depth also allows an easy integration of extender systems or format changers. The module fronts are integrated flush-mount into the housing front or back. The individual lettering can be done using our SYSBOXX labeling profile. Optionally the SYSPANEL can be closed from above with two covers (SYSPAN-C). The supplied rack brackets can be mounted in any orientation on the front or rear side of the device. The labeling profile as well as the modules are fastened in a time-saving manner with self-tapping M2.5 Torx screws.
Advantages:
High packing density on 1 RU
Great variability due to a wide selection of front panels for front and rear side (e.g. for building a connection panel for media servers)
Large installation depth for an easy integration of active electronics
Modularly equippable 19“ 1 RU panel, made of zinc-plated and powder-coated sheet steel for flush-mount attachment of five CARDINAL DVM-modules, SYFB21 or SYC1 modules. Tray housing, closed on three sides with 228 mm of installation depth.The large installation depth enables an easy integration of active electronics.A labeling profile for holding 7 mm paper strips or 6 mm self-adhesive labeling strips can be fixed through pre-punched holes for taking up M2.5 self-tapping screws. Likewise a cover (2 x SYSPAN-C) can be mounted to seal the entire housing top.The rear side offers 28 metal tongues as strain reliefs via cable ties plus an M4 grounding point.Front panel thickness 2.5 mmDimensions: 483 x 230 x 44 mmColor: RAL7016 powder labeling with fine-structure surfaceAdvantages: - High packing density on 1 RU - Great variability due to a wide selection of front panels for front and rear side (e.g. for building a connection panel for media servers) - Large installation depth for an easy integration of active electronics - Flexible, fast equipping - Subsequently alterable and thus future-proofTechnical Data:- Article number: SYSPAN55-XL - EAN: 4049371402385 - Type: SYSPANEL housing 19” for 5 x SYFB21/SYCFB21 panels on front and rear - Back: 28 metal reeds, M4-PE-bolts - Depth: 230 mm- Height unit: 1 HE
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